AT6350U
Specification:
Max PCB size 400X500mm
Workable area :400X500mm
PCB thickness :0.5-5mm
Max thickness :8mm with custom-made jig
Max size :70mm x 70mm
Min size :1mm x 1mm
Max weight :80g
Accuracy :20um
Temperature control
Upper heater :350℃
Lower heater :350℃
Bottom heater :300℃
Control model 16 zones of programmable temperature setting for profile
Power consumption System total power 8000W
Upper heater :1000W
Lower heater :1000W
Bottom heater :6000W
Dimension:870*920*1580mm
Weight Appox :300KG
Input voltage :Single phase AC 220V 50/60Hz 8.0KW
Features:
● Heater head and suction nozzle designed 2 in 1; functioned with auto-rotate, auto-align, auto-solder and auto-desolder;
● Suction nozzle move up individually, able to rework chipset 0101
● While moving the lower heater, we can adjust its height, which can avoid the problem that the components on PCB are damaged during the lower heater is moving.
● 7 electric motors controls all actions; vision system, top heating system and under heating system are all controlled by joystick; makes alignment fast;
● The traditional temperature control mode of on-off control is replaced by analog quantity control, which makes temperature more accurate;
● Three independent heating systems, temperature and time can be displayed digitally on the touch screen, able to repair difficultly-reworked BGA; with alarm function in abnormal heating;
● The top heater adopts independent patent design, cooling and heating designed 2 in 1, which makes temperature control more accurate;
● The bottom heater is consist of 6 pieces of imported light-wave heating tube. With high-temperature glass plate, heating can be controlled individually.
● Bottom preheat area can be adjusted according to PCB size to heat the PCB evenly to avoid deformation and keep soldering effect; With function of over-heating protection and environment-friendly.
● Top heater driven by servo motor; suction nozzle can identify material and mounting height automatically, and can control the air pressure within a small range;
● Both upper and lower hot-air heating head are movable on the IR preheating area to fit for reworking BGA in different positions on PCB.
● PCB support holder can be pulled out and set length, which is easy for clamping PCB
● Laser pointer for alignment, easy for fixing PCB
● With function of Bar code scanner reading program;
● Color optical system with functions of split vision, zoom - in and micro-adjustment, equipped with aberration detection device; with auto focus and software operation function,27X optical focus; able to rework BGA sized up to 70mm*70mm;
● Touch screen interface, PLC control; able to display set temperature curves and five detecting temperature curves at the same time; 8 segments of temperature up (down) and 8 segments constant temperature control, more than 50000 groups of profile can be stored.; Profile analysis can be carried out on the touch screen;
● Built in vacuum pump; max. vacuum suction up to 80g,which can be micro-adjusted. Suction nozzle can be rotated in 360°;
● The supports rack can be adjusted to restrain the local sinkage of the BGA soldering area;
● Finished the BGA rework process under the nitrogen save through remain the nitrogen joggle in advance, have special function for saving nitrogen to save cost.
● Heater head and mounting head are designed 2 in 1 ,auto memorize different BGA heating positions and alignment positions;
● Alloy nozzle can be located in 360°;
● Adjustable universal BGA Reballing Kit, fixed BGA Reballing Kit (can be custom-made)
● Common stencils for laptop BGA 33pcs/set
● Universal stencils or particular stencils (can be custom-made)
● Equipped with different suction nozzles in various specification;
● Equipped with different alloy hot air nozzles (can be custom-made)
