RW-E500A
Specifications:
PCB dimension: W20*D20~W600*D500mm
PCB thickness: 0.5~4mm
Placement precision: ±0.02mm
Working table adjustment: ±10mm forward/backward, ±10mm left/right
Temperature control: K-type thermocouple, close loop controlled
PCB locating way: Outer or jig
Preheater: far infrared, 6000W
Upper heater: hot air, 1000W
Lower heater: hot air, 1000W
Power supply: single-phase 380V, 50/60Hz, 10KW
Machine dimension: L1350*W800*H1800mm
Air supply:5~8kgf/cm
Weight: Appox. 180kg
Features:
●Hot air head and mounting head are designed 2 in 1, and, can store 5,0000 groups of working locations,with the function of auto soldering and mounting;
●Driven by X and Y axes step motor, operated with rocker bar , micro-movable when approaching the destination;able to store unlimited data; able to automatically suck BGA for soldering; after that, automatically place BGA to designated location;
●Color optical system with functions of split vision, zoom-in and micro-adjustment, equipped with abbreviation detection device, auto focus, software operation, 30X optical focus, able to rework BGA sized up to 70mm×70mm;
● Embedded industrial computer, touch screen interface, PLC control, real-time temperature curve display, able to display set curves and 9 detecting curves at the same time;
●Color LCD monitor;
●Suction nozzle can identify automatically material and mounting height, can constrain the pressure within a small range of 30~50g;
●Connected with nitrogen outside for nitrogen-protected soldering and desoldering;
●Build-in vacuum pump, 360° rotation in Φ angle; mounting nozzle is micro-adjustable;
●The supports rock can be adjusted to restrain the local sinkage of the BGA soldering area;
●8 segments of temperature up (down) and 8 segments constant temperature control, 5,0000 groups of temperature curve are stored, connected with computer, unlimited storage of curves; curve analysis can be carried out on the touch screen, comparing with the history saved curves; with computer communication function, communication software is attached;
●Three independent heating areas, temperature and time can be displayed digitally on the touch screen, can rework CGA;
●Both upper and lower hot-air heating heads are movable on the IR preheating area to fit for reworking BGA in different positions on PCB;
●Control independently through external computer, and finish all functions;
●Large IR pre-heating from the bottom will heat the PCB evenly to avoid deformation and keep soldering effect; heating board is independently controlled;
●Equipped with different alloy hot air nozzles, easy to replace, be able to locate in any angle.
●Driven by X and Y axes step motor, operated with rocker bar , micro-movable when approaching the destination;able to store unlimited data; able to automatically suck BGA for soldering; after that, automatically place BGA to designated location;
●Color optical system with functions of split vision, zoom-in and micro-adjustment, equipped with abbreviation detection device, auto focus, software operation, 30X optical focus, able to rework BGA sized up to 70mm×70mm;
● Embedded industrial computer, touch screen interface, PLC control, real-time temperature curve display, able to display set curves and 9 detecting curves at the same time;
●Color LCD monitor;
●Suction nozzle can identify automatically material and mounting height, can constrain the pressure within a small range of 30~50g;
●Connected with nitrogen outside for nitrogen-protected soldering and desoldering;
●Build-in vacuum pump, 360° rotation in Φ angle; mounting nozzle is micro-adjustable;
●The supports rock can be adjusted to restrain the local sinkage of the BGA soldering area;
●8 segments of temperature up (down) and 8 segments constant temperature control, 5,0000 groups of temperature curve are stored, connected with computer, unlimited storage of curves; curve analysis can be carried out on the touch screen, comparing with the history saved curves; with computer communication function, communication software is attached;
●Three independent heating areas, temperature and time can be displayed digitally on the touch screen, can rework CGA;
●Both upper and lower hot-air heating heads are movable on the IR preheating area to fit for reworking BGA in different positions on PCB;
●Control independently through external computer, and finish all functions;
●Large IR pre-heating from the bottom will heat the PCB evenly to avoid deformation and keep soldering effect; heating board is independently controlled;
●Equipped with different alloy hot air nozzles, easy to replace, be able to locate in any angle.
