RW-E6250

Specifications:
PCB dimension: W20*20~W450*W400mm
PCB thickness: 0.5~4mm
Applicable chip size: 1*1~80*80mm
Placement precision: ±0.01mm
PCB locating way: outer or jig
Working table adjustment: ±10mm forward/backward, ±10mm left/right
Temperature control: K-type thermocouple, close cycle controlled
Preheater: far infrared: 3600W
Top heater: hot air: 1000W
Bottom heater: hot air, 1000W
Power supply: single-phase 220V, 50/60Hz, 6KW
Air supply: 3~8kgf/cm2,95L/min
Machine dimension: L780×W850×H950mm
Weight: Appox 150kgs

Features:
●The machine body is coated with aluminium alloy; X/Y table are precision linear guide rails;
driven by SERVO motor,has both the auto soldering and mounting function; embeded with industrial
computer system, touch screen interface with both Chinese and English menu, PLC control;
adopts high-precision K-type thermocouple&close cycle control, with PID auto setting system.

●Profile analysis, setting and amendment can be carried out at any time, mass memory
temperature parameters and heating alignment parameters saving.

●Use adjustable high definition CCD color optical system with functions of split vision
zoom - in and micro-adjustment, equipped with aberration?detection device; with auto focus
and software operation function,27X optical zoom and 270X digital zoom; zoom control can be
carried out on touch screen.

●Be provided with software functions, including "IC hold", profile suspending or time-lapse
screen lock etc. which makes the opertion more human-friendly.

●Both upper and lower hot-air heating head are movable on the IR preheating area to fit
reworking BGA in different positions on PCB.
●Lower heater is mixed heating system with hot-air and IR; leave nitrogen port;
finish the BGA rework process under the nitrogen protection, have special function for saving
nitrogen to save cost.
●Built-in vacuum pump; 360° rotation in Φ angle; mounting nozzle is micro-adjustable;
Suction nozzle can identify material and mounting height automatically, and can control the air
pressure within a small range.

●With function of over-heating protection and air lost protection; upper heater is
anti-collision and anti-press function.

●Large IR area heater from the bottom will heat the PCB evenly to avoid deformation and keep
soldering effect; heating board is independently controlled;suitable for any kind of BGA package
including CCGA,BGA,QFN,CSP,LGA,Micro SMD,MLF(Micro Lead Frames)